PRIMARY OPTICAL DESIGN FOR LED
SECONDARY OPTICAL DESIGN FOR LENS
IR-LEDPower.0.15W ,0.5W,1W,1.5W,2W,3W, 8W
IR-LED angle: 30°,45°,60°,100°,120°
Package type: PLCC ,COB, CHIP,EMC
ombine LED ,Optical and circurt design
Mechanical and Thermal design
Production in test
Material :PMMA,PC,Epoxy
Property :Tailored transmission
Mirco-Optical of Package for LED
Mold design and processing
Facilities
.Class 10K clean rooms,and assembly stations.
.Die attach (die bonder, vacuum mixing, thermal/epoxy), Die shear tester
.Wire bond, ribbon bond, Wire bond pull tester
.Laser Marked
.Mold Surface preparation (grind, polish, metallization)
.Machine shop
.Incoming inspection system
.Screening/burn-in, accelerated aging
.Mechanical shock and vibration.
.Damp heat , temperature cycle and thermal shock
Product Qualification